Improving the quality of the treated surface by vibration assist cutting.
| Authors: Obraztsov A.E., Piskarev A.S. | |
| Published in issue: #2(103)/2026 | |
| DOI: | |
Category: Mechanical Engineering and Machine Science | Chapter: Technology and Equipment of Mechanical and Physical Processing |
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Keywords: vibration cutting, processing using vibration, processing of brittle materials, methods of vibration processing, chip formation during vibration cutting, oscillating movements, processing using oscillating movements, features of processing using oscillating movements |
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| Published: 26.03.2026 | |
Processing of brittle materials is difficult due to their tendency to crack during cutting. It is difficult to obtain a high-performance machining process, since the cutting depth is several micrometers, and for anisotropic single crystals such as KDP and DKDP less than one micrometer. This article examines a way to improve the productivity and quality of surface treatment of brittle materials using vibration cutting without the formation of surface and subsurface cracks. The main vibration processing methods used are considered, which include 1D (vibration displacement in one direction) and 2D (vibration displacement in two directions) vibration, their main advantages and disadvantages. It is rational to use this method when processing difficult-to-process and brittle materials.
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