Comparative analysis of modern methods of soldering printed circuit boards

Authors: Sorokin S.S., Maksimova A.M., Chelnokov E.D.
Published in issue: #11(76)/2022
DOI: 10.18698/2541-8009-2022-11-839
Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Instruments and Measuring Methods
Keywords: analysis, parameters, electronics, microelectronics, soldering, printed circuit boards, soldering connection, production of electronic equipment
Published: 06.12.2022

Currently, the main way to create an integral connection of the terminals of mounted components with the contact pads of printed circuit boards is soldering. The research of the technology of various soldering processes and solder joints was carried out in order to study the mechanism of formation of a solder joint and the conditions for obtaining a high-quality connection, ensuring the characteristics of the soldering process and controlling the parameters of operations. This article also briefly discusses modern methods of mounting elements on a board without soldering, as an alternative for products that should not be subjected to high-temperature heating during production, for example, due to the thermal sensitivity of individual elements or dense layout.

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